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Madisons City Engineer Robert Rob Phillips will retire at the end of April after over three decades of service to the City.

Phillips graduated from the University of Wisconsin-Madison with a Bachelors of Science Degree in Civil and Environmental Engineering in 1987. His career continued with promotions to more advanced engineer positions leading Public Works projects, managing federally-funded projects and leading the Citys Bridge Inspection and Construction Program. From 1992 until 2010, he served as Principal Engineer for the Transportation Design Section, and Assistant City Engineer. In 2010 he was promoted to City Engineer and has served in that role for the past 12 years.

Robs work leaves an incredible legacy in the infrastructure of our city, said Mayor Rhodes-Conway. He has provided steady and conscientious guidance to the Engineering Division over the years, and has been instrumental in many City-wide projects. His experience and expertise will be missed.

Phillips was involved in significant projects like the construction of John Nolen Drive in conjunction with the construction of Monona Terrace, the reconstruction of East Washington Avenue, the construction of County Highway M and rebuilding of most of the major streets that serve downtown. He additionally led the Citys Emergency Operations Center during the 2018 floods, which also led to the watershed studies underway in the city now.

I am proud of what we have been able to accomplish over my time with the City, Phillips said. We have been named best place to live, weve achieved platinum bike rating, were among one of the safest cities of our size for pedestrians, and so much more. These are not my personal accomplishments. It is an effort that involves every department. We collectively provide quality service to our residents and visitors and it shows. It makes a difference.

The City will conduct a nationwide search for Phillips successor. Engineering Division Deputy Division Manager Kathy Cryan will serve as interim manager of the Engineering Division.

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City Engineer Robert Phillips to Retire After 33 Years of City Service | City of Madison - City of Madison, Wisconsin

Osom, the company formed by Essentials employees after the startup went under, has released new details about its upcoming OV1 phone, including a very familiar list of build materials. Meant to compete with flagships from Apple, Google, and Samsung, the OV1 will have a stainless steel and titanium housing, a ceramic back, Corning Victus cover glass, and a Qualcomm processor.

The stainless steel is for the phones frame, while titanium will be used for accents like the power and volume buttons as well as the ring around the camera bump, according to Android Police. It sounds like the phone will have a heft to it Osom says the OV1 will be noticeably bigger than the Essential Phone, which had razor-thin bezels and a 5.7-inch screen. The company also says the phone will come in white and matte black but that there are some surprises to come in colors.

Talking to Osoms founder and CEO, Jason Keats, he said that the OV1 wasnt intentionally meant to evoke the Essential Phone. The resemblance is just the natural result of having the same team engineering and designing it. In my opinion, it still manages to stand out the materials are still relatively uncommon in most phones, even five years after we heaped praise on the Essential Phones build. Arguably, Apples probably the closest with the iPhone 13 Pros stainless steel sides and ceramic shield, but I think most people would be able to immediately tell the difference between the iPhone and an OV1. (Plus, theres the price Osom hasnt said exactly how much its phone would cost but told Android Police itd come in well under $1,000, which is where the 13 Pro starts.)

The OV1 was supposed to be fully revealed this week, according to TechCrunch, but Osom is pushing back its announcement and ship date so it can upgrade the phones processor. The company says itll use a Snapdragon 8 series chipset, though it cant give specifics, according to TechCrunch. Qualcomm recently switched up its naming scheme for chips with the Snapdragon 8 Gen 1, though it seems unlikely that the OV1 will use that specific chip given its vow of silence.

Osom says the phone will get all-day battery life and that itll have ultra-wideband, or UWB, the same tech other manufacturers like Apple, Google, and Samsung use for things like precision location tracking and digital car keys. Keats wouldnt say exactly what that radios for but said that the company has some interesting stuff cooking that it would announce later. It will have room for two physical SIM cards Keats says the company purposefully chose not to go with an e-SIM to avoid tying itself to particular carriers. (He also mentioned that partnering with a particular carrier was a devastating mistake for Essential.)

Osom says that its also learned from the camera missteps at Essential and that it wants the OV1 to have a truly flagship camera experience. Design-wise, the OV1 has a camera bump, something the Essential phone avoided. That bump holds the two rear cameras, running at 48 and 12 megapixels. The front-facing camera will be 16MP. Because of how important software is to the mobile photography experience, its hard to say how those specs will translate into snapshots at this point.

Finally, theres the USB cable that comes in the box. Theres usually not a lot to say about those, but Osoms including one with a neat trick: the ability to flip a switch that physically disconnects the data pins, so you can feel more comfortable charging your phone from a public outlet. Keats couldnt say how fast the OV1 will charge, just that it will be impressively quick. It is BYOB (bring your own brick), though it wont ship with a charger in the box.

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This is the Osom OV1, a new phone from Essentials former engineers and designers - The Verge

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Jerra Hill

Jerra Hill, fiscal analyst in the Industrial Engineering Department, was named Employee of the Second Quarter for the College of Engineering. This award recognizes staff who play an integral part in the college's daily routines.

Hill has been a member of industrial engineering since May of 2011. She is the financial manager for the Master of Science in operations management and M.S. in engineering management graduate programs in the Department of Industrial Engineering.

Hill's supervisor, Rich Ham, associate director for the engineering management and operations management programs, nominated Hill, stating her "performance consistently exceeds position requirements, goals and management's expectations." Ham said, "Jerra consistently ensures that her work product is of the highest quality and accuracy, regardless of the work hours required for completion."

He continued, "As the program has grown, she directly supports over 800 students and the resource needs of more than 60 faculty. She developed transparent processes to navigate the complex reimbursement and cost-share agreements with other programs and Global Campus. Unlike other programs, the M.S. in operations management and M.S. in engineering management operate solely on income and must adjust the budget based on revenue."

In his nomination of Hill, Ham stated, "Demonstrating flexibility, she also manages a $50,000 marketing/recruitment budget and coordinates more than 10 conference booths annually. Jerra designed the tools to effectively handle $3.5 million of gross revenue, returning nearly $900,000 to central administration, Global Campus, the college and the department. Her resource management initiatives resulted in over $75,000 of annual savings that not only directly affected her programs but allowed the department, college and university to hire faculty and invest in infrastructure. Additionally, Jerra negotiated non-credit course reimbursements for the program exceeding $50,000."

Greg Parnell, professor of practice and director of the M.S. in operations management and M.S. in engineering management programs, commented: "Jerra has been a critical member of our team. She has provided us the financial management and visibility we needed to make agile decisions on marketing, new course developments and new certificate developments that have maintained the enrollment growth in both programs."

Ed Pohl, professor and head of the Department of Industrial Engineering, stated, "Jerra has done an outstanding job supporting our distance education programs in the department. She is a skilled financial analyst who does an excellent job keeping the program directors apprised of all financial management issues with the programs. Her dedication and support have made a significant impact on our programs, and her efforts are truly appreciated."

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Hill Named College of Engineering Employee of the Second Quarter - University of Arkansas Newswire

The time has come for the engineering community to cast your vote for the DesignCon 2022 Engineer of the Year. This award is given out each year during the DesignCon event and seeks to recognize the best of the best in engineering and new product advancements at the chip, board, or system level, with a special emphasis on signal integrity and power integrity.

Editors of Design News and the staff of DesignCon would like to offer hearty congratulations to the finalists. For this years award, the winner (or his/her representative) will be able to direct a $1,000 donation to any secondary educational institution in the United States. The details on each nominee are below as provided in their published biographies and by the person/s who made the nomination. Please cast your vote byfollowing this link.

Related: DesignCon 2022 Engineer of the Year Nominations Are Now Open

Voting closes at noon Pacific Time on March 11. The winner will be announced at DesignCon 2022, April 5-7 at the Santa Clara Convention Center, Santa Clara, CA.

The four finalists for the 2022 DesignCon Engineer of the Year Award are (click each name to see finalists bio and community activity):

Related: DesignCon 2022 Locks in High-Caliber Keynote Speaker Lineup for April Event

Cast your vote for the 2022 Engineer of the Year

Learn more about DesignCon and register to attend

Scott McMorrow,CTO, Samtec

Scott McMorrow currently serves as CTO for Samtecs Signal Integrity Group, Inc. As a consultant for years too numerous to mention, Scott has helped many companies develop high-performance products while training signal integrity engineers.

Scott started Samtecs webinar series gEEk spEEk, providing virtual engineering learning. Scott also works on Samtecs Twinax technology, pushes EDA companies to focus on signal integrity, developed advanced crosstalk analysis and power delivery methodology. He has related RF EDA to signal integrity (meshing, boundary conditions, computational space, etc.) and has a long history of supporting, speaking at, and writing for DesignCon.

Scott received a DesignCon 2021 Best Paper Award for his work on the paper A Case Study in the Development of a 112 Gbps-PAM4 Silicon & Connector Test Platform.

Richard Mellitz,Distinguished Engineer, Samtec

Samtec

Richard Mellitz is presently a Distinguished Engineer at Samtec, supporting interconnect signal integrity and industry standards. Prior to this, he was a Principal Engineer in the Platform Engineering Group at Intel. Richard was a principal member of various Intel processor and I/O bus teams including Itanium, Pentium, PCI Express, SAS, and Fabric (Ethernet, IB, and proprietary). Additionally, he has been a key contributor for the channel sections IEEE802.3 backplane and cabling standards, and for the time domain ISI and return loss standards for IEEE802.3 Ethernet, known as COM (Channel Operating Margin) and ERL (Effective Return Loss), which are now an integral part of Ethernet standards due to Richs leadership.

He founded and chaired an IPC (Association Connecting Electronics Industries) committee delivering IPCs first PCB loss test method. Prior to this, Rich led industry efforts at IPC to deliver the first TDR (time domain reflectometry) standard which is presently used throughout the PCB industry. Richard holds many patents in interconnect, signal integrity, design, and test. He has delivered numerous signal integrity papers at electronic industry design conferences.

Richard contributed to three DesignCon 2022 papers, see more information in the online agenda.

Steve Sandler,Founder, Picotest.com

Picotest

Steve Sandler has been involved with power system engineering for more than 40 years. Steve is the founder of PICOTEST.com, a company specializing in power integrity solutions including measurement products, services, and training. He frequently lectures and leads workshops internationally on the topics of power, PDN and distributed systems and is a Keysight certified expert for EDA software. Steve frequently writes articles and books related to power supply and PDN performance and his latest book, Power Integrity Using ADS was published by Faraday Press in 2019. Steve founded AEi Systems, a well-established leader in worst-case circuit analysis and troubleshooting of high-reliability systems.

Steve is a long-time and very active member of the DesignCon Technical Program Committee, and received a DesignCon 2017 Best Paper Award for his paper, Characterizing and Selecting the VRM.

For DesignCon 2022, Steve is planning to speak at a tutorial, present a paper, and participate in a panel. You can see the session details on the online agenda.

Lambert (Bert) Simonovich,Founder, Lamsim Enterprises

Lamsim

Lambert (Bert) Simonovich graduated from Mohawk College of Applied Arts and Technology, Hamilton, Ontario Canada, as an Electronic Engineering Technologist. Over a 32-year career, working at Bell Northern Research/Nortel in Ottawa Canada, he helped pioneer several advanced technology solutions into products. He has held a variety of engineering, research, and development positions, eventually specializing in high-speed signal integrity and backplane design. In 2009, he founded Lamsim Enterprises Inc., where he continues to provide innovative signal integrity and backplane solutions as a consultant. He has authored several publications and holder of two US patents.

In addition to being a senior member of IEEE, he currently serves as a member of DesignCon's Technical Program Committee, EDICon's Technical Advisory Committee, and Signal Integrity Journal's Editorial Advisory Board. His current research interests include high-speed signal integrity, modeling, and characterization of high-speed serial link architectures. His most notable modeling achievement is the development of the "Cannonball-Hurry" conductor roughness model used in several electronic design automation (EDA) software tools.

Bert has received Best Paper Awards for his 2019 paper PCB Interconnect Modeling Demystified, and the 2018 paper A Causal Conductor Roughness Model and its Effect on Transmission Line Characteristics.

Cast your vote for the 2022 Engineer of the Year. Voting closes at noon Pacific Time on March 11.

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Vote for the 2022 Engineer of the Year - Design News