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DesignCon, the nations largest event for chip, board, and systems design engineers, today announced new areas of focus for the 2020 edition highlighting advances in the fields of5G, artificial intelligence (AI),automotive, andIoT, producing the most in-demandelectronicsemerging today. Topics will be examined through a 14-track conference schedule spanning technical sessions, boot camps, tutorials, and more to fit the needs of the hardware design engineering community. DesignCon returns to Silicon Valley for its 25thyear, taking place from January 28-30, 2020 at the Santa Clara Convention Center.

The DesignCon conference and expo reflects the design engineering industrys growing need for breakthroughs in the development of5Gconnectivity, AI,automotiveelectronics, and IoT. With worldwide spending on AI systems forecasted to reach$79.2 billion in 2022, sales ofautomotiveelectronic systems at itshighest growth rateon-record, expected worldwide spending on IoT projected to surpass$1 trillion in 2022, and the5Ginfrastructure market estimated to reach$4.2 billion in value by 2020, DesignCon is the ideal forum for attendees across these interlaced industries to exchange ideas and develop solutions to meet consumer demand.

The market and value for connected, especially fast connected products, is on the rise, said Suzanne Deffree, brand director, Intelligent Systems & Design, Informa Markets. DesignCon is the most comprehensive event available to the design engineer community, enabling attendees to collaborate toward these growing opportunities and innovate beyond current demand. We pride ourselves on being the industrys leading educational event, helping the brightest minds understand and master the latest technology and applications on the market.

The DesignCon premier educational conference is curated by theTechnical Program Committee (TPC), an expert panel of more than 90 industry professionals who review and update the curriculum each year to meet the needs of the ever-evolving high-speed communications and semiconductor industry.

Featured conference content of interest at DesignCon 2020 include:

Electronic Design Automation Roadmap for Machine Learning & AI StandardizationCurrently, EDA has no roadmap for machine learning (ML) and AI with a timetable to meet design and manufacturing needs. A roadmap would provide a framework to study targeted ML/AI functions and describe dependencies between industry organizations. Defining functional needs with business goals will identify methodology gaps for new R&D from industry and academia. In this panel, industry and academic experts will discuss and debate the following areas critical to developing an EDA ML/AI roadmap: concept unification, software interoperability, high-volume data handling and exchange, and learning from other disciplines.

A System-Level Power Integrity Study of Multi-Domain Power Supply Noise CouplingDuring this technical session, Dmitry Klokotov, staff signalintegrityengineer at Xilinx, will present a system-level study of power supply noise coupling between different power distribution networks. The system is built around a large programmable SoC device, which is currently used in a variety of cutting-edge applications such as AI, Cloud, IoT, etc. An SoC chip hosts many different blocks with different power demands, restrictions, and requirements. Different blocks need to operate side by side and interact with each other. Insuring powerintegrityof such a system becomes challenging and it is particularly difficult to manage noise coupling via a shared return path. Klokotovs powerintegritystudy covers pre-silicon modeling, hardware verification, and correlation steps.

Electronic/Photonic IC Design for5GRF ApplicationsPhotonic integrated circuits are rapidly advancing in several applications, such as datacom and telecom, virtual reality, sensors,automotive, and medical applications. Validated, unified Electronic/Photonic Design Automation (EPDA) tool flows are key to bringing standardization and scalability to silicon photonics, including implementing5Gand WiGig. This tutorial will introduce a PDK-based design flow enabling RF designs for5Gand WiGig. Experts from leading EDA and photonics design tools vendors will demonstrate how close integration between schematic capture, electronic-photonic co-simulation, and layout tools, together with electronic/photonic PDKs delivers silicon-proven5Gdesigns. Attendees will learn about EPDA co-design and co-simulation, as well as photonic-specific compact model libraries (CMLs), in addition to getting hands-on experience with the latest EPDA design tools and foundry PDK.

Introduction to LIDARLIDAR (Light Detection and Ranging) is widely considered a necessity for fully automated self-drivingautomotiveapplications. In order to sample the far field with sufficient resolution, LIDAR systems must incorporate either a large number of optical emitters or a means of steering the optical emission from a small number of outputs across the far field. Due to the density of optical components required, LIDAR is ripe for optical integration in order to achieve miniaturization and scalable manufacturability. This talk will give an overview of LIDAR techniques, the components required for a chip-scale LIDAR solution, and the state of the art in silicon photonics with respect to this goal.

DesignCon 2020 is also supported byThe Institute of Electrical and Electronics Engineers (IEEE), offering its accreditation to conference attendees. Each conference hour is eligible for one professional development hour (PDH), and 10 PDHs result in one continuing education unit (CEU) and an official IEEE certificate. IEEE accreditation can be used to meet training requirements, stand out to future employers, and maintain an engineering license.

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DesignCon Expands Into Artificial Intelligence, Automotive, 5G, IoT, and More For 2020 Edition - I-Connect007